21486产品概述
NC257MD solder paste has been specifically designed for the MyData MY500 Jet Printer. Its unique rheological properties were engineered and validated through extensive testing to provide continuous and consistent deposits. NC257MD provides the necessary tack time and force for today’s high speed placement equipment, which will enhance product performance and reliability. The superior wetting ability of NC257MD results in bright, smooth and shiny solder joints. It also offers very low post process residues, which remain crystal clear and easily probed. NC257MD is supplied in Iwashita 30 cc syringes which are labeled with the standard MY500 Jet Printer bar code for easy product recognition that will automatically set machine jetting parameters.
Features
Designed for MyData MY500 Jet Printer
Clear Pin-Probe Testable Residue
Excellent Wetting, Even Leadless Devices
Reduces Voiding Under Micro-BGAs
12-14 Hour Tack Time
Vapor Phase Compatible