8030产品概述
Underfill FF35 is a non-odorous, low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Faster throughput and higher yields are achieved through excellent capillary action, faster flow characteristics and rapid cure speeds.
Feartures
Excellent Capillary Function for Fast Reflow
Compatible with No-Clean Flux Residues
Odorless During Printing and Curing
25%-35% Faster flow
Reworkable at 120°C
Good Storage Properties
No Voiding