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8146 - 

ONE-STEP Underfill 688; 30 cc; No-Flow Underfill Flip Chip; CSP; BGA; and MICRO-BGA

Aim 8146
声明:图片仅供参考,请以实物为准!
制造商:
Aim Aim
制造商产品编号:
8146
仓库库存编号:
70054304
技术数据表:
View 8146 Datasheet Datasheet
订购热线: 400-900-3095  0755-21000796, QQ:800152669, Email:sales@szcwdz.com
由于产品数据库庞大,部分产品信息可能未能及时更新,下单前请与销售人员确认好实时在库数量,谢谢合作!

8146产品概述



One-Step Underfill 688 is a non-odorous, low surface tension, one component epoxy resin designed as a one-step no-flow underfill for flip chip, CSP, BGA and micro-BGA assemblies. One-Step Underfill 688 improves product reliability through high Tg, low CTE, and good fill with no voiding. Even though One-Step Underfill 688 does not require flux, it is compatible with no-clean flux residues and provides excellent adhesion. One-Step Underfill 688 can be dispensed directly following solder paste printing, after which components are placed and the entire assembly is reflowed and cured simultaneously in a standard lead-free reflow process. This eliminates the need for a second assembly process and separate cure cycle. The result of this is faster throughput and higher yields that are achieved in one step through excellent capillary action, fast reflow characteristics, and rapid cure speeds. One-Step Underfill 688 may be reworked at 120°C and the viscosity of the product remains stable through out its shelf life. This product wets solder to OSP, ENIG, immersion silver, and immersion tin board surfaces.
Features
  • Excellent Capillary Function for Fast Reflow
  • Compatible with No-Clean Flux Residues
  • Odorless During Printing and Curing
  • Flux Action to Make Solder Connections
  • Non-Hygroscopic
  • Reworkable
  • Good Storage Properties
  • No Voiding
  • Cures in Lead-Free Profile
  • 8146产品信息

      Brand/Series  8 Series  
      Color  Purple  
      Physical State  Liquid  
      Special Features  Flows at 120°C — 140°C  
      Specific Gravity  1.27 g/cc  
      Temperature Range  Maximum at 255°C  
      Time, Setting  Up to 150°C — ≤ 75 seconds, From 150°C to 175°C — 30-60 seconds, Peak Temperature 235°C to 250°C — 60 seconds  
      Volatile  total is < 1%  
    关键词         

    8146相关搜索

    Brand/Series 8 Series  Aim Brand/Series 8 Series  Epoxy Compounds Brand/Series 8 Series  Aim Epoxy Compounds Brand/Series 8 Series   Color Purple  Aim Color Purple  Epoxy Compounds Color Purple  Aim Epoxy Compounds Color Purple   Physical State Liquid  Aim Physical State Liquid  Epoxy Compounds Physical State Liquid  Aim Epoxy Compounds Physical State Liquid   Special Features Flows at 120°C — 140°C  Aim Special Features Flows at 120°C — 140°C  Epoxy Compounds Special Features Flows at 120°C — 140°C  Aim Epoxy Compounds Special Features Flows at 120°C — 140°C   Specific Gravity 1.27 g/cc  Aim Specific Gravity 1.27 g/cc  Epoxy Compounds Specific Gravity 1.27 g/cc  Aim Epoxy Compounds Specific Gravity 1.27 g/cc   Temperature Range Maximum at 255°C  Aim Temperature Range Maximum at 255°C  Epoxy Compounds Temperature Range Maximum at 255°C  Aim Epoxy Compounds Temperature Range Maximum at 255°C   Time, Setting Up to 150°C — ≤ 75 seconds, From 150°C to 175°C — 30-60 seconds, Peak Temperature 235°C to 250°C — 60 seconds  Aim Time, Setting Up to 150°C — ≤ 75 seconds, From 150°C to 175°C — 30-60 seconds, Peak Temperature 235°C to 250°C — 60 seconds  Epoxy Compounds Time, Setting Up to 150°C — ≤ 75 seconds, From 150°C to 175°C — 30-60 seconds, Peak Temperature 235°C to 250°C — 60 seconds  Aim Epoxy Compounds Time, Setting Up to 150°C — ≤ 75 seconds, From 150°C to 175°C — 30-60 seconds, Peak Temperature 235°C to 250°C — 60 seconds   Volatile total is < 1%  Aim Volatile total is < 1%  Epoxy Compounds Volatile total is < 1%  Aim Epoxy Compounds Volatile total is < 1%  
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