8153产品概述
Epoxy 4089 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4089 has a formulated tolerance to shear-thinning, a dot formation suitable for automated dispense equipment or positive displacement pump systems, and quick cure properties when exposed to heat. Viscosity and surface tension of Epoxy 4089 are adequate for use with high speed placement equipment.
Features
For Printing and Dispensing Applications
One Part Epoxy
Good for High Speed PlacementEquipment
Fast Curing
Non-Stringing Formula
High Shear Strength