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Recommended for printing applications, Epoxy 4044 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4044 has a formulated tolerance to shear-thinning, which is suitable for automated printing equipment and quick cure properties when exposed to heat. Viscosity and surface tension of Epoxy 4044 are adequate for use with high speed placement equipment.
Features

For Printing and Dispensing Applications

One Part Epoxy

Good For High Speed Placement Equipment

Fast Curing

Non-Stringing Formula

High Shear Strength

Boiling Point	>260°C
Brand/Series	8 Series
Color	Yellow
Heat Deflection Temp	97°C
Odor	Aromatic (slightly)
Physical State	Solid (thick paste)
Specific Gravity	1.13 (wate = 1)
Tensile Strength	11500 psi
Viscosity	300-500 kcps
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  Epoxy 4089; Bonding SMT Components to aPWB; 10cc Syringe; Dispensing Apps
  
  型号：8152
  仓库库存编号：70054295
  
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  Epoxy 4089; Bonding SMT Components to aPWB; 30cc Syringe; Dispensing Apps
  
  型号：8153
  仓库库存编号：70054296
  
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  Epoxy 4089; for Bonding SMT Components to a PWB; 12 FL.OZ. Jar; Dispensing Apps
  
  型号：8155
  仓库库存编号：70054298
  
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  ONE-STEP Underfill 688; 30 cc; No-Flow Underfill Flip Chip; CSP; BGA; and MICRO-BGA
  
  型号：8146
  仓库库存编号：70054304
  
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Boiling Point >260°C  Aim Boiling Point >260°C  Epoxy Compounds Boiling Point >260°C  Aim Epoxy Compounds Boiling Point >260°C   Brand/Series 8 Series  Aim Brand/Series 8 Series  Epoxy Compounds Brand/Series 8 Series  Aim Epoxy Compounds Brand/Series 8 Series   Color Yellow  Aim Color Yellow  Epoxy Compounds Color Yellow  Aim Epoxy Compounds Color Yellow   Heat Deflection Temp 97°C  Aim Heat Deflection Temp 97°C  Epoxy Compounds Heat Deflection Temp 97°C  Aim Epoxy Compounds Heat Deflection Temp 97°C   Odor Aromatic (slightly)  Aim Odor Aromatic (slightly)  Epoxy Compounds Odor Aromatic (slightly)  Aim Epoxy Compounds Odor Aromatic (slightly)   Physical State Solid (thick paste)  Aim Physical State Solid (thick paste)  Epoxy Compounds Physical State Solid (thick paste)  Aim Epoxy Compounds Physical State Solid (thick paste)   Specific Gravity 1.13 (wate = 1)  Aim Specific Gravity 1.13 (wate = 1)  Epoxy Compounds Specific Gravity 1.13 (wate = 1)  Aim Epoxy Compounds Specific Gravity 1.13 (wate = 1)   Tensile Strength 11500 psi  Aim Tensile Strength 11500 psi  Epoxy Compounds Tensile Strength 11500 psi  Aim Epoxy Compounds Tensile Strength 11500 psi   Viscosity 300-500 kcps  Aim Viscosity 300-500 kcps  Epoxy Compounds Viscosity 300-500 kcps  Aim Epoxy Compounds Viscosity 300-500 kcps