MP850-200-1%产品概述
Use your thermal design experience with power semiconductors in TO-220 style power packages to help you get the most out of this unique family of power resistors. The thermal design issues are the same where power handling capability is based on the case temperature which is maintained in your design.
Temperature Coefficient: ΔR taken at +175°C ref. to +25°C. 5.00 ohms and above: –20 to +50 ppm/°C 0.50 ohm to 4.99 ohm: –20 to +80 ppm/°C 0.050 ohm to 0.49 ohm: 0 to +200 ppm/°C 0.020 ohm to 0.049 ohm: 0 to +300 ppm/°C.
Measurement Note: For these specifications, resistance measurement shall be made at a point 0.2" (5 mm) from the resistor body.
Specifications
Thermal Resistance (Rφj-c): 7.50 °C/W
Voltage Rating: 300 Vrms AC
Non-Inductive Design
DWV: 1500 Vrms AC, the Resistor Element Is Isolated from the Metal Tab and Mounting Surface
Power Rating Note: The case temperature is used to establish the max. applied power, see Derating Curve. The case temperature measurement is made with a thermocouple contacting the bottom mounting surface of the package (center of heat dissipating surface), the device mounted on the heat sink with thermal grease.
Without a Heat Sink when in free air at +25°C the MP Resistors have the following power ratings: MP820 and MP821: 2.25 W; MP2060: 2.50 W.
Datasheet
