RS1G-E3/2GT产品概述
Features:
Low Profile Package
Ideal for Automated Placement
Glass Passivated Chip Junction
Low Forward Voltage Drop
Low Leakage Current
High Forward Surge Capability
Meets MSL level 1, Per J-STD-020, LF Maximum Peak of 260°C
Solder Dip 260°C, 40 s
Component in Accordance to RoHS 2002/95/EC and WEEE 2002/96/EC