SAC7.0-E3/54产品概述
Features:
Low Profile Package Ideal for Automated Placement Glass Passivated Chip Junction Available in Uni-Directional and Bi-Directional Excellent Clamping Capability Very Fast Response Time Low Incremental Surge Resistance Meets MSL Level 1, per J-STD-020, LF Maximum Peak of 260°C Solder Dip 260°C, 40 s Component in Accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Applications: Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, automotive and telecommunication.