SMBJ12A-E3/52产品概述
Features:
Low Profile Package Ideal for Automated Placement Glass Passivated Chip Junction Available in Uni-Directional and Bi-Directional 600 W Peak Pulse Power Capability with a 10/1000 μs Waveform, Repetitive Rate (Duty Cycle): 0.01% Excellent Clamping Capability Very Fast Response Time Low Incremental Surge Resistance Meets MSL Level 1, Per J-STD-020, LF Maximum Peak of 260°C Solder Dip 260°C, 40 s Component in Accordance to RoHS 2002/95/EC and WEEE 2002/96/EC Applications: Use in sensitive electronics protection against voltage transients induced by inductive load switching and lighting on ICs, MOSFET, signal lines of sensor units for consumer, computer, industrial, automotive and telecommunication.