04-7068-0000产品概述
Designed specifically as a low-cost alternative to traditional lead-free alloys, Ultrapure® K100 is a near-eutectic tin/copper alloy with controlled metallic dopants to manage the grain structure within the solder joint. This improves joint reliability and virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in completely filled and shinier solder joints than traditional lead-free alloy alternatives.
The unique triangular shape of this lead-free bar is a Kester Advantage that will greatly benefit our customers and the industry's eventual switch to lead-free assembly. In effort to further reduce in confusion in the customer's production lines when dual systems are used, Kester introduces the industry's first easily distinguishable lead-free triangular solder bar.
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