24-7068-1402产品概述
High activity and instant wetting action allows for quick and reliable soldering with lead-free alloys. The non-corrosive, non-conductive flux is ideal for creating a strong, long-lasting bond. Available in any size ranging from 0.010" to 0.250". Typical lead-free alloy is Sn96.5 Ag3 Cu0.5 (SAC305).