41650产品概述
MG Chemical Copper Electroplating Tank. Copper Electroplating is the process in which a layer of copper is deposited on the item to be plated by using an electric current. For the electronics industry, copper electroplating is commonly used to plate through-holes or to strengthening existing copper traces or contacts. This placing tank will work with any electroplating system in the market.
Features
Holds 2 gallons of plating solution
Open bus bars make it easy to hang anodes and cathode hook
Bus bars are removable for easy cleaning in between uses
Usable for prototyping pcb’s up to 4" × 6" in size
Contains
3.3 gallon plastic tank with holes for bus bards
Tank lid
Two solid copper anode bus bars (3⁄8" × 10.5") with red wires and connector
One solid copper cathode bus bar ("3⁄8 × 10.5") with black wire and connector
5" copper cathode hook