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8329TCS-200ML - 

ADHESIVE - THERMALLY CONDUCTIVE EPOXY, SLOW CURE

MG Chemicals 8329TCS-200ML
声明:图片仅供参考,请以实物为准!
制造商产品编号:
8329TCS-200ML
仓库库存编号:
70276184
技术数据表:
View 8329TCS-200ML Datasheet Datasheet
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8329TCS-200ML产品概述

MG Chemicals thermal adhesive is used for thermal management situations requiring superior bonding strengths, good thermal transfers, and non electrically conductive. It is great for heat sink bonding. It is also used as a high-powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat.

8329TCS-200ML产品信息

  Density  2.17 g/cm3  
  Dielectric Strength  6.6 @ 4.188 mm kV/mm  
  Elongation  7.0 %  
  Shelf Life  5 years years  
  Tensile Strength  11.4 N/mm2  
  Thermal Conductivity  @ 25° C 1.44 W/(m·K)  
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