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MG Chemicals thermal adhesive is used for thermal management situations requiring superior bonding strengths, good thermal transfers, and non electrically conductive. It is great for heat sink bonding. It is also used as a high-powered LED adhesive that maximizes the lifetime of LEDs by dissipating their heat.

Density	2.17 g/cm3
Dielectric Strength	6.6 @ 4.188 mm kV/mm
Elongation	7.0 %
Shelf Life	5 years years
Tensile Strength	11.4 N/mm2
Thermal Conductivity	@ 25° C 1.44 W/(m·K)
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• MG Chemicals
  ADHESIVE - THERMALLY CONDUCTIVE EPOXY, MEDIUM CURE
  
  型号：8329TCM-6ML
  仓库库存编号：70276181
  
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Density 2.17 g/cm₃  MG Chemicals Density 2.17 g/cm₃  Epoxy Compounds Density 2.17 g/cm₃  MG Chemicals Epoxy Compounds Density 2.17 g/cm₃   Dielectric Strength 6.6 @ 4.188 mm kV/mm  MG Chemicals Dielectric Strength 6.6 @ 4.188 mm kV/mm  Epoxy Compounds Dielectric Strength 6.6 @ 4.188 mm kV/mm  MG Chemicals Epoxy Compounds Dielectric Strength 6.6 @ 4.188 mm kV/mm   Elongation 7.0 %  MG Chemicals Elongation 7.0 %  Epoxy Compounds Elongation 7.0 %  MG Chemicals Epoxy Compounds Elongation 7.0 %   Shelf Life 5 years years  MG Chemicals Shelf Life 5 years years  Epoxy Compounds Shelf Life 5 years years  MG Chemicals Epoxy Compounds Shelf Life 5 years years   Tensile Strength 11.4 N/mm₂  MG Chemicals Tensile Strength 11.4 N/mm₂  Epoxy Compounds Tensile Strength 11.4 N/mm₂  MG Chemicals Epoxy Compounds Tensile Strength 11.4 N/mm₂   Thermal Conductivity @ 25° C 1.44 W/(m·K)  MG Chemicals Thermal Conductivity @ 25° C 1.44 W/(m·K)  Epoxy Compounds Thermal Conductivity @ 25° C 1.44 W/(m·K)  MG Chemicals Epoxy Compounds Thermal Conductivity @ 25° C 1.44 W/(m·K)