Smartphone makers face challenges of PCB space, cost and assembly time when specifying the connections and shielding and grounding of electronic components in their mobile applications. These barriers can sometimes be circumvented with the use of simpler solutions such as spring clips (known also as spring contacts, grounding springs, spring fingers or RF contacts) to provide connections between electronic sub-components, modules or RF devices (example: antennas) and the phone’s PC board or casing. Molex spring clips lower component and assembly-processing costs with added benefits of wide working range and superb durability.
Features
Wide working range from 0.25 to 1.10mm
Anti-snag design prevents contact damage during assembly processing and yield loss
Narrow clip width of 1.00mm supports small PCB applications
1,500 durability cycles delivers sustained high performance
Datasheet
