16-02-1109产品概述
The SL™ 0.100" (2.54mm) pitch modular, single row wire-to-board and wire-to-wire system is designed for high density signal applications. The system includes: low profile latching vertical and right angle headers; low profile housings for male and female crimp terminals; pre-assembled, single piece pin and receptacle connectors for Insulation Displacement Technology (IDT); panel mounts for modular wire-to-wire remote interconnections; and SL™ offers design flexibility and automated harness-making capabilities when combined with our tooling. Has the ability to mate with the dual row C-Grid® products and KK® products.
Datasheet
