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Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimizes crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

Number of Contacts	4
Primary Type	Board-to-Board
Termination	Solder
Type	Header
关键词

Number of Contacts 4  TE Connectivity Number of Contacts 4  Connectors Number of Contacts 4  TE Connectivity Connectors Number of Contacts 4   Primary Type Board-to-Board  TE Connectivity Primary Type Board-to-Board  Connectors Primary Type Board-to-Board  TE Connectivity Connectors Primary Type Board-to-Board   Termination Solder  TE Connectivity Termination Solder  Connectors Termination Solder  TE Connectivity Connectors Termination Solder   Type Header  TE Connectivity Type Header  Connectors Type Header  TE Connectivity Connectors Type Header