2-641604-2产品概述
AMP DIP Socket, Beryllium Copper Contact Material, 0.100 " Centerline, 0.128 " Terminal Post Length
Solder Tail Dual Leaf (DL) SocketsDual Wiping ContactsFace Wipe Contacts for High Reliability and Constant, Low ResistanceStackable End-to-End and Side-to-Side (Brickwalling) for High Board DensityHousing Standoffs and Slots Facilitate Board CleaningRetention Style Tails or Straight Solder TailsDesigned for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded)Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, BlackContacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating