2-641611-1产品概述
DIP IC Socket, 18 Number of Positions, Beryllium Copper Contact Material, +105 °C Temperature Range
Solder Tail Dual Leaf (DL) SocketsDual Wiping ContactsFace Wipe Contacts for High Reliability and Constant, Low ResistanceStackable End-to-End and Side-to-Side (Brickwalling) for High Board DensityHousing Standoffs and Slots Facilitate Board CleaningRetention Style Tails or Straight Solder TailsDesigned for Automatic Machine Insertion - DIP-to-Socket or Socket-to-Board (Tube Loaded)Housing: Glass-Filled Thermoplastic, 94 V-0 Rated, BlackContacts: Phosphor Bronze or Beryllium Copper with Tin or Gold Plating