821942-1产品概述
132 Positions, Tube Packaging Type, 0.025 in. Centerline, Black, Sockets
0.025 centerline for high density, low cost packaging. Low profile permits even higher density packaging with only 0.375 maximum height pc boards. High normal force and positive engagement allows for reliable service to minimize field failures. Closed-bottom housing aids in prevention of solder bridging between contacts. Economical design makes socketing of semi-conductor devices more attractive. Sockets can be spaced a minimum of 0.150 from each other.
Material and Finish:
Housing: High Temperature Thermoplastic, 94 V-O Rated, BlackCover: Polyphenylene Sulfide (PPS), 94 V-O Rated, BlackContacts: Phosphor Bronze with 0.000200 (0.00508) TIn Over 0.000050 (0.00127) Nickel