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WonderMASK® PX is a temporary, peelable, latex solder mask designed to dry in half the time of standard peelable solder masks. It is hand applied and can withstand fluxing, wave soldering and cleaning operations. It effectively masks and protects open through-holes and underside components in a wave soldering process, and can be used as a conformal coatings mask.
WonderMASK PX can remain on all areas of the board until ready for test, and then, be easily peeled away. In addition, WonderMASK PX is ideally suited for situations where a thick coat of mask is required. WonderMASK PX has been specially formulated to cure homogenously, virtually eliminating any limit on the deposition thickness.

Fast Drying – dries in half the time of standard peelable masks

Ideal for situations where a thick coat of mask is required

Peelable Mask

Able to withstand temperatures up to 650°F / 343°C

Prevents solder from flowing into contacts, terminals, screw heads, and plated through holes
Mask for conformal coating

Will not tarnish gold or phosphor bronze

Protects delicate components

Brand/Series	2222 Series
Chemical Component	Titanium Dioxide
Density	1.09 to 1.17 g/mL
Dispensing Method	Squeeze Bottle
pH	9.5 to 11.0
Physical State	White Viscous Liquid
Solubility	Fully miscible ( in water)
Temperature, Rating	650° F / 343° C
Thickness	15 mils
Type	Solder Mask
Viscosity	9,000-16,000 cps
Weight	16 Oz.
关键词

Brand/Series 2222 Series  TechSpray Brand/Series 2222 Series  Solder Masks Brand/Series 2222 Series  TechSpray Solder Masks Brand/Series 2222 Series   Chemical Component Titanium Dioxide  TechSpray Chemical Component Titanium Dioxide  Solder Masks Chemical Component Titanium Dioxide  TechSpray Solder Masks Chemical Component Titanium Dioxide   Density 1.09 to 1.17 g/mL  TechSpray Density 1.09 to 1.17 g/mL  Solder Masks Density 1.09 to 1.17 g/mL  TechSpray Solder Masks Density 1.09 to 1.17 g/mL   Dispensing Method Squeeze Bottle  TechSpray Dispensing Method Squeeze Bottle  Solder Masks Dispensing Method Squeeze Bottle  TechSpray Solder Masks Dispensing Method Squeeze Bottle   pH 9.5 to 11.0  TechSpray pH 9.5 to 11.0  Solder Masks pH 9.5 to 11.0  TechSpray Solder Masks pH 9.5 to 11.0   Physical State White Viscous Liquid  TechSpray Physical State White Viscous Liquid  Solder Masks Physical State White Viscous Liquid  TechSpray Solder Masks Physical State White Viscous Liquid   Solubility Fully miscible ( in water)  TechSpray Solubility Fully miscible ( in water)  Solder Masks Solubility Fully miscible ( in water)  TechSpray Solder Masks Solubility Fully miscible ( in water)   Temperature, Rating 650° F / 343° C  TechSpray Temperature, Rating 650° F / 343° C  Solder Masks Temperature, Rating 650° F / 343° C  TechSpray Solder Masks Temperature, Rating 650° F / 343° C   Thickness 15 mils  TechSpray Thickness 15 mils  Solder Masks Thickness 15 mils  TechSpray Solder Masks Thickness 15 mils   Type Solder Mask  TechSpray Type Solder Mask  Solder Masks Type Solder Mask  TechSpray Solder Masks Type Solder Mask   Viscosity 9,000-16,000 cps  TechSpray Viscosity 9,000-16,000 cps  Solder Masks Viscosity 9,000-16,000 cps  TechSpray Solder Masks Viscosity 9,000-16,000 cps   Weight 16 Oz.  TechSpray Weight 16 Oz.  Solder Masks Weight 16 Oz.  TechSpray Solder Masks Weight 16 Oz.