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Teledyne LS Series
Teledyne LS series solid-state single inline package (SIP) relays are designed for mounting on printed circuit boards. The LS Series relays facilitate heat sinking by providing an interface surface. They can switch loads with high starting currents, the nominal switched currents depend on the size of the heat sink and are limited by the cross section of the tracks of the printed circuit (mainly 25A/30A). The relays use a direct-bonded copper substrate for thermal efficiency, thermal stress performance and long-life expectancy.

Brand Family	LS
Brand/Series	LS Series
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