Y16291K00000T9R产品概述
The VFCP Series utilizes ultra precision Bulk Metal® Z-Foil. The Z-Foil technology provides a significant reduction to the resistive element's sensitivity to ambient temperature variations (TCR) and to self heating when power is applied (power coefficient). Along with the inherently low PCR and TCR, Z-Foil technology also provides remarkably improved load life stablility, low noise and availability of tight tolerance. The flip chip configuration provides a substantial PCB space saving of more than 35 % vs. a surface mount chip with wraparound terminations. The VFCP is available in any value within the specified resistance range.
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