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With fins oriented vertically in cabinet sidewall applications, 401 and 403 Series heat sinks are recommended for critical space applications where maximum heat dissipation is required for high-power TO-3 case styles. Forced convection performance is also exemplary with these double surface fin types. Semiconductor mounting hole style F offers a single centered 0.270 in. (6.9)-diameter mounting hole (with a 0.750 in. (19.1)-diameter area free of anodize) for mounting stud-type diodes and rectifiers. Hole pattern V available upon request. Material: Aluminum Alloy, Black Anodized.

Brand/Series	401 Series
Finish	Black Anodized
For Use With	TO-3, Stud Mount
Material	Aluminum
Primary Type	TO-3/Stud Mount
Thermal Resistance	1.5 °C/W
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Brand/Series 401 Series  Wakefield Brand/Series 401 Series  Heatsinks Brand/Series 401 Series  Wakefield Heatsinks Brand/Series 401 Series   Finish Black Anodized  Wakefield Finish Black Anodized  Heatsinks Finish Black Anodized  Wakefield Heatsinks Finish Black Anodized   For Use With TO-3, Stud Mount  Wakefield For Use With TO-3, Stud Mount  Heatsinks For Use With TO-3, Stud Mount  Wakefield Heatsinks For Use With TO-3, Stud Mount   Material Aluminum  Wakefield Material Aluminum  Heatsinks Material Aluminum  Wakefield Heatsinks Material Aluminum   Primary Type TO-3/Stud Mount  Wakefield Primary Type TO-3/Stud Mount  Heatsinks Primary Type TO-3/Stud Mount  Wakefield Heatsinks Primary Type TO-3/Stud Mount   Thermal Resistance 1.5 °C/W  Wakefield Thermal Resistance 1.5 °C/W  Heatsinks Thermal Resistance 1.5 °C/W  Wakefield Heatsinks Thermal Resistance 1.5 °C/W