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658-60ABT3 - 

Heatsink; Omnidirectional; 15.2mm; Black Anodized; with Tape

Wakefield 658-60ABT3
声明：图片仅供参考，请以实物为准！
制造商产品编号：
658-60ABT3
仓库库存编号：
70236703
技术数据表：
View 658-60ABT3 Datasheet Datasheet
订购热线： 400-900-3095  0755-21000796, QQ:800152669, Email:sales@szcwdz.com
由于产品数据库庞大，部分产品信息可能未能及时更新，下单前请与销售人员确认好实时在库数量，谢谢合作！

658-60ABT3产品概述

Omnidirectional Pin Fin Heat Sink for BGAs and PowerPC™

658-60ABT3产品信息

  Application  Integrated Circuits  
  Brand/Series  658 Series  
  Color  Black  
  Configuration  Omnidirectional  
  Dimensions  1.1 Sq. in.  
  Finish  Black Anodized  
  For Use With  BGA  
  Height, Above PC Board  0.6 in.  
  Material  Aluminum  
  Mounting Style  Omnidirectional  
  Package Type  BGA  
  Primary Type  BGAs/PowerPC?  
  Special Features  Omnidirectional Fin Pin  
  Thermal Resistance  2 °C/W  
  Type  Omnidirectional  
  Weight  14.17 g  
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658-60ABT3相关搜索

Application Integrated Circuits  Wakefield Application Integrated Circuits  Heatsinks Application Integrated Circuits  Wakefield Heatsinks Application Integrated Circuits   Brand/Series 658 Series  Wakefield Brand/Series 658 Series  Heatsinks Brand/Series 658 Series  Wakefield Heatsinks Brand/Series 658 Series   Color Black  Wakefield Color Black  Heatsinks Color Black  Wakefield Heatsinks Color Black   Configuration Omnidirectional  Wakefield Configuration Omnidirectional  Heatsinks Configuration Omnidirectional  Wakefield Heatsinks Configuration Omnidirectional   Dimensions 1.1 Sq. in.  Wakefield Dimensions 1.1 Sq. in.  Heatsinks Dimensions 1.1 Sq. in.  Wakefield Heatsinks Dimensions 1.1 Sq. in.   Finish Black Anodized  Wakefield Finish Black Anodized  Heatsinks Finish Black Anodized  Wakefield Heatsinks Finish Black Anodized   For Use With BGA  Wakefield For Use With BGA  Heatsinks For Use With BGA  Wakefield Heatsinks For Use With BGA   Height, Above PC Board 0.6 in.  Wakefield Height, Above PC Board 0.6 in.  Heatsinks Height, Above PC Board 0.6 in.  Wakefield Heatsinks Height, Above PC Board 0.6 in.   Material Aluminum  Wakefield Material Aluminum  Heatsinks Material Aluminum  Wakefield Heatsinks Material Aluminum   Mounting Style Omnidirectional  Wakefield Mounting Style Omnidirectional  Heatsinks Mounting Style Omnidirectional  Wakefield Heatsinks Mounting Style Omnidirectional   Package Type BGA  Wakefield Package Type BGA  Heatsinks Package Type BGA  Wakefield Heatsinks Package Type BGA   Primary Type BGAs/PowerPC?  Wakefield Primary Type BGAs/PowerPC?  Heatsinks Primary Type BGAs/PowerPC?  Wakefield Heatsinks Primary Type BGAs/PowerPC?   Special Features Omnidirectional Fin Pin  Wakefield Special Features Omnidirectional Fin Pin  Heatsinks Special Features Omnidirectional Fin Pin  Wakefield Heatsinks Special Features Omnidirectional Fin Pin   Thermal Resistance 2 °C/W  Wakefield Thermal Resistance 2 °C/W  Heatsinks Thermal Resistance 2 °C/W  Wakefield Heatsinks Thermal Resistance 2 °C/W   Type Omnidirectional  Wakefield Type Omnidirectional  Heatsinks Type Omnidirectional  Wakefield Heatsinks Type Omnidirectional   Weight 14.17 g  Wakefield Weight 14.17 g  Heatsinks Weight 14.17 g  Wakefield Heatsinks Weight 14.17 g  
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