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Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

Brand/Series	907 Series
Dimensions	33 x 32.6 mm
Finish	Black Anodized
For Use With	BGA
Material	Aluminum
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Brand/Series 907 Series  Wakefield Brand/Series 907 Series  Heatsinks Brand/Series 907 Series  Wakefield Heatsinks Brand/Series 907 Series   Dimensions 33 x 32.6 mm  Wakefield Dimensions 33 x 32.6 mm  Heatsinks Dimensions 33 x 32.6 mm  Wakefield Heatsinks Dimensions 33 x 32.6 mm   Finish Black Anodized  Wakefield Finish Black Anodized  Heatsinks Finish Black Anodized  Wakefield Heatsinks Finish Black Anodized   For Use With BGA  Wakefield For Use With BGA  Heatsinks For Use With BGA  Wakefield Heatsinks For Use With BGA   Material Aluminum  Wakefield Material Aluminum  Heatsinks Material Aluminum  Wakefield Heatsinks Material Aluminum