908-35-2-23-2-B-0 -

Heatsink; Fin Pin with clip assembly; 35 x 22.6 mm

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制造商：: Wakefield Wakefield
制造商产品编号：: 908-35-2-23-2-B-0
仓库库存编号：: 70357067
技术数据表：: Datasheet

订购热线： 400-900-3095 0755-21000796, QQ:800152669, Email:sales@szcwdz.com

由于产品数据库庞大，部分产品信息可能未能及时更新，下单前请与销售人员确认好实时在库数量，谢谢合作！

908-35-2-23-2-B-0产品概述

Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, and Cloud Computing Industries.

908-35-2-23-2-B-0产品信息

908-35-2-23-2-B-0相关搜索

Brand/Series 908 Series Wakefield Brand/Series 908 Series Heatsinks Brand/Series 908 Series Wakefield Heatsinks Brand/Series 908 Series Dimensions 35 x 22.6 mm Wakefield Dimensions 35 x 22.6 mm Heatsinks Dimensions 35 x 22.6 mm Wakefield Heatsinks Dimensions 35 x 22.6 mm Finish Black Anodized Wakefield Finish Black Anodized Heatsinks Finish Black Anodized Wakefield Heatsinks Finish Black Anodized For Use With BGA Wakefield For Use With BGA Heatsinks For Use With BGA Wakefield Heatsinks For Use With BGA Material Aluminum Wakefield Material Aluminum Heatsinks Material Aluminum Wakefield Heatsinks Material Aluminum Thermal Resistance 2.1 °C/W Wakefield Thermal Resistance 2.1 °C/W Heatsinks Thermal Resistance 2.1 °C/W Wakefield Heatsinks Thermal Resistance 2.1 °C/W

Brand/Series	908 Series
Dimensions	35 x 22.6 mm
Finish	Black Anodized
For Use With	BGA
Material	Aluminum
Thermal Resistance	2.1 °C/W
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